PC Edge AI PN-Palladio-500-RPL-AI

IAde inferencia de IAGPU

Descripción
The Palladio 500 RPL AI is a high-performance industrial workstation for edge AI and advanced graphics applications, powered by 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics. Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics.

Aspectos destacados

• CPU: 13th Gen Intel® Core™ i3/i5/i7/i9 Processors
• AI Accelerator: Intel® Arc™ Pro B50 powered AI acceleration (up to 170 INT8 TOPS)
• Memory: Up to 32 GB SO-DIMM DDR4 2666
• Connectivity: 2x 2.5 GbE LAN (2x PoE optional)

CPU — Modelos disponibles

• Intel® Core™ i3-13100E, 3.3~4.4 GHz, 4 processor cores, 8 threads - 60 W TDP
• Intel® Core™ i3-13100TE, 2.1~4.1 GHz, 4 processor cores, 8 Threads - 35 W TDP
• Intel® Core™ i5-13500E, 2.4~4.6 GHz, 14 processor cores, 20 Threads - 65 W TDP
• Intel® Core™ i5-13500TE, 1.3~4.5 GHz, 14 processor cores, 20 Threads - 35 W TDP
• Intel® Core™ i7-13700E, 1.9~5.1 GHz, 16 processor cores, 24 Threads - 65 W TDP
• Intel® Core™ i7-13700TE, 1.1~4.8 GHz, 16 processor cores, 24 Threads - 35 W TDP
• Intel® Core™ i9-13900E, 1.8~5.2 GHz, 24 processor cores, 32 Threads - 65 W TDP
• Intel® Core™ i9-13900TE, 1.0~5.0 GHz, 24 processor cores, 32 Threads - 35 W TDP

Gráficos y vídeo
Intel® Arc™ Pro B50 Graphics powered graphics with 16 GB DDR6 VRAM. Support for up to four independent displays at up to 8K60 resolution.

• Video interfaces: 2x DisplayPort
• Video resolution: Up to 4K @60 Hz

Memoria y almacenamiento

• Memoria: Up to 32 GB SO-DIMM DDR4 2666 (optional)
• Mass storage options: 1x M.2 2280 (SATA); 1x M.2 2280 (PCIe Gen 4 x4; SATA); 1x M.2 2280 (PCIe Gen 4 x4); 2x SATA 2.5” drives (optional hot-swap)

Conectividad y expansión

• Networking: Intel® embedded M.2 2230 802.11ac Wi-Fi BT 5.1 card with cables (optional); Dual-band wireless 6.3” terminal PIFA antenna (optional); 2x 2.5 GbE LAN (2x PoE optional)
• USB: 6x USB 3.2 Gen 2 ports
• PCI / M.2: 1x mPCIe (PCIe x1; USB 2.0); 1x M.2 2230 E-key (PCIe x1; USB 2.0); 1x M.2 2280 M-key (PCIe Gen 4 x4); 1x M.2 2280 M-key (PCIe Gen 4 x4; SATA); 1x M.2 3042/3052/2280 B-key (PCIe x2; USB 2.0; USB 3.0; SATA); 1x PCIe Gen 4 x16 or 2x PCIe Gen 4 x8 (factory option)
• Audio: 1x 3.5mm audio
• Serial ports: 2x COM RS-232/422/485 ports
• Other interfaces: 5-Pin terminal block power Input (12~48 VDC); 2x ModBay expansion 7-9.5mm (optional); 1x GPIO terminal block (DIO, CAN, Ext. Switch); 2x 3FF Micro-SIM; 1x power button; 1x external fan connector; 2x 2.5” hot-swap drives (optional)

Sistema, seguridad y gestión

• Security: PTT in BIOS; TPM (optional); Watchdog timer
• Operating System: Compatible with Linux, Windows
• Device management & updates: OTA updates, device monitoring and secure OS integration supported (Clea-based solutions)

Condiciones operativas y alimentación

• Power supply: 12~48 VDC (20~48 VDC when configured with PCIe expansion 70W or above)
• Operating temperature: -40 to 70°C (with 35W CPU); -40 to 50°C (with 65W CPU)

caractéristiques / spécifications techniques

• Modelo comercial: Palladio 500 RPL AI
• Marca: SECO
• Dimensiones: 240 x 143 x 267 mm
• CPU: 13th Gen Intel® Core™ (Raptor Lake-P) — múltiples variantes (i3 / i5 / i7 / i9) con TDPs 35 W / 60 W / 65 W según modelo
• GPU: Intel® Arc™ Pro B50, 16 GB DDR6 VRAM
• Memoria: Up to 32 GB SO-DIMM DDR4 2666
• Almacenamiento: múltiples M.2 2280 (SATA / PCIe Gen4 x4), M.2 B-key y opcional 2x SATA 2.5” hot-swap
• Red: 2x 2.5 GbE LAN (2x PoE opcional), opción Wi‑Fi/Bluetooth M.2 2230
• USB: 6x USB 3.2 Gen 2
• Interfaces adicionales: COM RS-232/422/485 (2x), GPIO (DIO, CAN), ModBay expansions, Micro-SIM x2
• Entradas de alimentación: 5-pin terminal block (12~48 VDC)
• Sistemas operativos compatibles: Linux, Windows
• Temperatura de operación: -40…70°C (35W); -40…50°C (65W)